Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.