Invention Grant
- Patent Title: Thermosetting resin composition, and prepreg and substrate using same
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Application No.: US16313298Application Date: 2017-06-29
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Publication No.: US10774173B2Publication Date: 2020-09-15
- Inventor: Hee Jin Cho , Do Kyung Sung , Sae Rom Nam
- Applicant: KOLON INDUSTRIES, INC.
- Applicant Address: KR Seoul
- Assignee: KOLON INDUSTRIES, INC.
- Current Assignee: KOLON INDUSTRIES, INC.
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@233be7d
- International Application: PCT/KR2017/006900 WO 20170629
- International Announcement: WO2018/004273 WO 20180104
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/26 ; C08G59/22 ; C08G59/24 ; C08G59/40 ; C08G59/56 ; C08J5/24 ; C08L63/00 ; C08G59/46 ; C08L63/08 ; C08K5/357 ; C08G59/50 ; C08K5/00 ; C08K5/17 ; C08G59/42 ; C08K5/10 ; C08G59/62 ; C08G59/64 ; C08G73/22 ; H05K1/03
Abstract:
The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.
Public/Granted literature
- US20190153151A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG AND SUBSTRATE USING SAME Public/Granted day:2019-05-23
Information query
