公开(公告)号：US10766887B2

公开(公告)日：2020-09-08

申请号：US16312650

申请日：2017-06-30

Applicant: KOLON INDUSTRIES, INC.

Inventor： Sae Rom Nam ,  Do Kyung Sung ,  Hee Jin Cho

IPC: C07D413/10 ,  C07D265/16 ,  C07D265/14 ,  C08G73/02 ,  C07D413/14 ,  C08L79/04

Abstract: The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.

公开(公告)号：US10774173B2

公开(公告)日：2020-09-15

申请号：US16313298

申请日：2017-06-29

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hee Jin Cho ,  Do Kyung Sung ,  Sae Rom Nam

IPC: B32B27/38 ,  B32B27/26 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40 ,  C08G59/56 ,  C08J5/24 ,  C08L63/00 ,  C08G59/46 ,  C08L63/08 ,  C08K5/357 ,  C08G59/50 ,  C08K5/00 ,  C08K5/17 ,  C08G59/42 ,  C08K5/10 ,  C08G59/62 ,  C08G59/64 ,  C08G73/22 ,  H05K1/03

Abstract: The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.

公开(公告)号：US10266504B2

公开(公告)日：2019-04-23

申请号：US15322946

申请日：2015-06-30

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hee Jin Cho ,  Do Kyung Sung ,  Ki Hyun Park ,  Sang Hun Park ,  Hyun Soo Kagn

IPC: C08G61/00 ,  C07D265/14 ,  C08G61/12 ,  C07D265/12 ,  C07D413/10

Abstract: Disclosed is a polybenzoxazime precursor and a method of preparing the same. The polybenzoxazime precursor is used to prepare a hardened material having improved thermal characteristics, having high thermal and flame-retardant characteristics while maintaining its excellent electrical characteristics, or having high thermal and electrical characteristics, thus being available for use in a copper clad laminate, a semiconductor encapsulate, a printed circuit board, an adhesive, a paint, and a mold.

公开(公告)号：US10144716B2

公开(公告)日：2018-12-04

申请号：US15532576

申请日：2015-12-07

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hee Jin Cho ,  Do Kyung Sung ,  Ki Hyun Park ,  Sang Hun Park

IPC: C07D265/14 ,  C07D265/12 ,  C07D265/10 ,  C08G8/10 ,  C08K5/18 ,  C08G61/12

Abstract: This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.