- Patent Title: Printed circuit board and semiconductor package including the same
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Application No.: US16126221Application Date: 2018-09-10
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Publication No.: US10777495B2Publication Date: 2020-09-15
- Inventor: Soojae Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f392112
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L23/14 ; H01L21/683 ; H01L25/10 ; H01L23/00
Abstract:
A printed circuit board comprises an epoxy-containing member, a first copper pattern disposed adjacent to the epoxy-containing member, and a first adhesion promoter layer interposed between the epoxy-containing member and the first copper pattern.
Public/Granted literature
- US20190252306A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2019-08-15
Information query
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