Invention Grant
- Patent Title: Apparatus and method for the manufacturing of printed wiring boards on a substrate
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Application No.: US14392408Application Date: 2014-12-01
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Publication No.: US10779451B2Publication Date: 2020-09-15
- Inventor: Michael Knox , Andrew Ippoliti , Georgios Kyriakou , Carlos Ospina , Nicolas Vansnick
- Applicant: Michael Knox , Andrew Ippoliti , Georgios Kyriakou , Carlos Ospina , Nicolas Vansnick
- Applicant Address: US NY Long Island City
- Assignee: BotFactory, Inc.
- Current Assignee: BotFactory, Inc.
- Current Assignee Address: US NY Long Island City
- Agent Herbert F. Ruschmann
- International Application: PCT/US2014/067986 WO 20141201
- International Announcement: WO2015/081347 WO 20150604
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K3/12 ; H05K3/34 ; H05K3/46

Abstract:
An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
Public/Granted literature
- US20160381844A1 APPARATUS AND METHOD FOR THE MANUFACTURING OF PRINTED WIRING BOARDS AND COMPONENT ATTACHMENT Public/Granted day:2016-12-29
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