Invention Grant
- Patent Title: Strain gauge with mechanically decoupled temperature sensor
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Application No.: US15899204Application Date: 2018-02-19
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Publication No.: US10782196B2Publication Date: 2020-09-22
- Inventor: Daniele Caltabiano
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Slater Matsil, LLP
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01B7/16 ; G01D5/16 ; G01L1/04 ; G01L1/06 ; G01L1/18 ; G01L19/00 ; G01L9/04 ; G01L9/00
Abstract:
A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.
Public/Granted literature
- US20190257703A1 STRAIN GAUGE WITH MECHANICALLY DECOUPLED TEMPERATURE SENSOR Public/Granted day:2019-08-22
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