Invention Grant
- Patent Title: Heat dissipation system and method for smart pianos
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Application No.: US16057606Application Date: 2018-08-07
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Publication No.: US10782714B2Publication Date: 2020-09-22
- Inventor: Yangyi Teng , Shaolin Yang , Jianli Zhao
- Applicant: SUNLAND INFORMATION TECHNOLOGY CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SUNLAND INFORMATION TECHNOLOGY CO., LTD.
- Current Assignee: SUNLAND INFORMATION TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Metis IP LLC
- Main IPC: G05D23/19
- IPC: G05D23/19 ; G10H1/00 ; G10H1/34 ; G05B15/02 ; G10F1/02 ; G01K13/00

Abstract:
A heat dissipation system for a smart piano may include a heat dissipation driver, a heat dissipation device, a sensor, a protection circuit and a hardware processor. The sensor may be configured to detect a thermal parameter of an execution device of the smart piano. The protection circuit may be configured to analyze the thermal parameter to generate a protection signal. The hardware processor may be configured to determine a preset algorithm, generate a control signal according to the protection signal and the preset algorithm, and control a heat dissipation condition of the smart piano. The controlling the heat dissipation condition of the smart piano may include control an operation condition of the execution device and/or the heat dissipation device. The controlling may include controlling an output power of the execution device and/or the heat dissipation device.
Public/Granted literature
- US20180348802A1 HEAT DISSIPATION SYSTEM AND METHOD FOR SMART PIANOS Public/Granted day:2018-12-06
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