公开(公告)号：US10782714B2

公开(公告)日：2020-09-22

申请号：US16057606

申请日：2018-08-07

Applicant: SUNLAND INFORMATION TECHNOLOGY CO., LTD.

Inventor： Yangyi Teng ,  Shaolin Yang ,  Jianli Zhao

IPC: G05D23/19 ,  G10H1/00 ,  G10H1/34 ,  G05B15/02 ,  G10F1/02 ,  G01K13/00

Abstract: A heat dissipation system for a smart piano may include a heat dissipation driver, a heat dissipation device, a sensor, a protection circuit and a hardware processor. The sensor may be configured to detect a thermal parameter of an execution device of the smart piano. The protection circuit may be configured to analyze the thermal parameter to generate a protection signal. The hardware processor may be configured to determine a preset algorithm, generate a control signal according to the protection signal and the preset algorithm, and control a heat dissipation condition of the smart piano. The controlling the heat dissipation condition of the smart piano may include control an operation condition of the execution device and/or the heat dissipation device. The controlling may include controlling an output power of the execution device and/or the heat dissipation device.