Invention Grant
- Patent Title: Self-aligned airgaps with conductive lines and vias
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Application No.: US15827613Application Date: 2017-11-30
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Publication No.: US10784156B2Publication Date: 2020-09-22
- Inventor: Benjamin D. Briggs , Lawrence A. Clevenger , Bartlet H. Deprospo , Huai Huang , Christopher J. Penny , Michael Rizzolo
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L21/768 ; H01L23/522 ; H01L23/532
Abstract:
A conductive line structure comprises a first conductive line arranged in a first dielectric layer, a second conductive line arranged in the first dielectric layer, a cap layer arranged on the first conductive line and the second conductive line, and an airgap arranged between the first conductive line and the second conductive line, the airgap defined by the first dielectric layer and the cap layer.
Public/Granted literature
- US20180082885A1 SELF-ALIGNED AIRGAPS WITH CONDUCTIVE LINES AND VIAS Public/Granted day:2018-03-22
Information query
IPC分类:
