Invention Grant
- Patent Title: Semiconductor package
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Application No.: US16163614Application Date: 2018-10-18
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Publication No.: US10784206B2Publication Date: 2020-09-22
- Inventor: Wen-Sung Hsu , Tao Cheng , Nan-Cheng Chen , Che-Ya Chou , Wen-Chou Wu , Yen-Ju Lu , Chih-Ming Hung , Wei-Hsiu Hsu
- Applicant: MEDIATEK Inc.
- Applicant Address: TW Hsinchu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/683 ; H01Q9/04 ; H01L23/498 ; H01Q1/22 ; H01L23/31 ; H01L25/10 ; H01L23/50 ; H01Q21/06 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L25/00 ; H01L25/065 ; H01L25/16 ; H01L23/66 ; H01L23/14
Abstract:
A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
Public/Granted literature
- US20190051609A1 SEMICONDUCTOR PACKAGE Public/Granted day:2019-02-14
Information query
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