- Patent Title: Semiconductor package device and method of manufacturing the same
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Application No.: US15175992Application Date: 2016-06-07
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Publication No.: US10784208B2Publication Date: 2020-09-22
- Inventor: Kuo-Hsien Liao , Cheng-Nan Lin , Chieh-Chen Fu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/66 ; H01L23/31 ; H01L21/56 ; H01L25/16 ; H01L23/29 ; H01L25/065 ; H01L23/538
Abstract:
The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. The carrier includes an antenna area and a component area. The first antenna is formed on the antenna area. The second antenna extends from the antenna area and over the first antenna. The second antenna is electrically connected to the first antenna. The package body includes a first portion covering the component area and a second portion covering the antenna area. The first shield is conformally formed on the first portion of the package body and exposes the second portion of package body.
Public/Granted literature
- US20170077039A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-16
Information query
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