公开(公告)号：US12266644B2

公开(公告)日：2025-04-01

申请号：US17170666

申请日：2021-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Chi-Han Chen ,  Chieh-Chen Fu

IPC: H01L25/16 ,  H01L23/538 ,  H01L33/52 ,  H01L33/58 ,  G02B6/42

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US10431554B2

公开(公告)日：2019-10-01

申请号：US15871805

申请日：2018-01-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia Lin ,  Chieh-Chen Fu ,  Kuo Hsien Liao ,  Cheng-Nan Lin

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device package includes: (1) a carrier; (2) an electronic component disposed over a top surface of the carrier; (3) a package body disposed over the top surface of the carrier and covering the electronic component; and (4) a shield layer, including a first magnetically permeable layer disposed over the package body, a first electrically conductive layer disposed over the first magnetically permeable layer, and a second magnetically permeable layer disposed over the first electrically conductive layer. The first electrically conductive layer is interposed between the first magnetically permeable layer and the second magnetically permeable layer. A permeability of the first electrically conductive layer is different from a permeability of the first magnetically permeable layer and a permeability of the second magnetically permeable layer.

公开(公告)号：US20170077039A1

公开(公告)日：2017-03-16

申请号：US15175992

申请日：2016-06-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuo-Hsien Liao ,  Cheng-Nan Lin ,  Chieh-Chen Fu

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L23/66

Abstract: The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. The carrier includes an antenna area and a component area. The first antenna is formed on the antenna area. The second antenna extends from the antenna area and over the first antenna. The second antenna is electrically connected to the first antenna. The package body includes a first portion covering the component area and a second portion covering the antenna area. The first shield is conformally formed on the first portion of the package body and exposes the second portion of package body.

Abstract translation: 本公开提供一种半导体封装器件及其制造方法。 在本公开的实施例中，半导体封装器件包括载体，第一天线，第二天线，封装主体和第一屏蔽。 载体包括天线区域和组件区域。 第一天线形成在天线区域上。 第二天线从天线区域和第一天线延伸。 第二天线电连接到第一天线。 封装主体包括覆盖部件区域的第一部分和覆盖天线区域的第二部分。 第一屏蔽保形地形成在封装主体的第一部分上并使封装体的第二部分露出。

公开(公告)号：US11474301B2

公开(公告)日：2022-10-18

申请号：US17144114

申请日：2021-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng You ,  Jr-Wei Lin ,  Chieh-Chen Fu ,  Kao-Ming Su ,  Chen Yuan Weng

IPC: G02B6/36 ,  G02F1/1337 ,  G02F1/29 ,  G02F1/133

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

公开(公告)号：US09871005B2

公开(公告)日：2018-01-16

申请号：US14990366

申请日：2016-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia Lin ,  Chieh-Chen Fu ,  Kuo Hsien Liao ,  Cheng-Nan Lin

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/81

Abstract: A semiconductor device package includes a carrier, an electronic component disposed over a top surface of the carrier, and a package body disposed over the top surface of the carrier and covering the electronic component. The semiconductor device package further includes a shield layer, which in turn includes a first electrically conductive layer, a first magnetically permeable layer, and a second electrically conductive layer, where the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer.

公开(公告)号：US11329016B2

公开(公告)日：2022-05-10

申请号：US16789246

申请日：2020-02-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Wei Hsieh ,  Chieh-Chen Fu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/22 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an emitting device, a first building-up circuit and a first package body. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The emitting element is disposed on the first surface of carrier. The first building-up circuit is disposed on the second surface of the carrier. The first package body encapsulates the lateral surface of the carrier.

公开(公告)号：US09269673B1

公开(公告)日：2016-02-23

申请号：US14521342

申请日：2014-10-22

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： I-Chia Lin ,  Chieh-Chen Fu ,  Kuo-Hsien Liao ,  Cheng-Nan Lin

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/60

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49822 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012

Abstract: A semiconductor device package includes a substrate, at least one component, a package body, a first conductive layer, a first shielding layer, a second shielding layer and a second conductive layer. The component is disposed on a first surface of the substrate. The package body is disposed on the first surface of the substrate and covers the component. The first conductive layer covers the package body and at least a portion of the substrate. The first shielding layer covers the first conductive layer and has a first thickness and includes a high conductivity material. The second shielding layer covers the first shielding layer and has a second thickness and includes a high permeability material. A ratio of the first thickness to the second thickness being in a range of 0.2 to 3. The second conductive layer covers the second shielding layer.

Abstract translation: 半导体器件封装包括衬底，至少一个部件，封装体，第一导电层，第一屏蔽层，第二屏蔽层和第二导电层。 该部件设置在基板的第一表面上。 包装体设置在基板的第一表面上并覆盖该部件。 第一导电层覆盖封装主体和衬底的至少一部分。 第一屏蔽层覆盖第一导电层并且具有第一厚度并且包括高导电性材料。 第二屏蔽层覆盖第一屏蔽层并且具有第二厚度并且包括高磁导率材料。 第一厚度与第二厚度的比率在0.2至3的范围内。第二导电层覆盖第二屏蔽层。

公开(公告)号：US10930627B2

公开(公告)日：2021-02-23

申请号：US16236186

申请日：2018-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Chi-Han Chen ,  Chieh-Chen Fu

IPC: H01L25/16 ,  H01L33/52 ,  H01L23/538 ,  H01L33/58 ,  G02B6/42

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US10784208B2

公开(公告)日：2020-09-22

申请号：US15175992

申请日：2016-06-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuo-Hsien Liao ,  Cheng-Nan Lin ,  Chieh-Chen Fu

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01L25/16 ,  H01L23/29 ,  H01L25/065 ,  H01L23/538

Abstract: The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. The carrier includes an antenna area and a component area. The first antenna is formed on the antenna area. The second antenna extends from the antenna area and over the first antenna. The second antenna is electrically connected to the first antenna. The package body includes a first portion covering the component area and a second portion covering the antenna area. The first shield is conformally formed on the first portion of the package body and exposes the second portion of package body.