Invention Grant
- Patent Title: Three-dimensional (3D) printing composite build material composition
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Application No.: US15763167Application Date: 2016-01-29
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Publication No.: US10786950B2Publication Date: 2020-09-29
- Inventor: Pavel Kornilovich , Vladek Kasperchik , Michael G. Monroe
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanuagh PC
- International Application: PCT/US2016/015715 WO 20160129
- International Announcement: WO2017/131758 WO 20170803
- Main IPC: B29C67/24
- IPC: B29C67/24 ; C08K7/28 ; B33Y30/00 ; B33Y10/00 ; B29C64/165 ; C08K3/013 ; C08L77/02 ; C08K3/22 ; B33Y70/00 ; B33Y50/02 ; B29C67/00

Abstract:
A three-dimensional (3D) printing composite build material composition includes a polymer particle and an inorganic particle. The polymer particle is an aliphatic polyamide. The inorganic particle has an average particle size ranging from about 1 μm to about 100 μm. A mass ratio of the polymer particle to the inorganic particle in the composite build material composition ranges from about 5:2 to about 1:3.
Public/Granted literature
- US20180264753A1 THREE-DIMENSIONAL (3D) PRINTING COMPOSITE BUILD MATERIAL COMPOSITION Public/Granted day:2018-09-20
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