Invention Grant
- Patent Title: Fiducial-filtering automatic wafer centering process and associated system
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Application No.: US16131692Application Date: 2018-09-14
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Publication No.: US10790237B2Publication Date: 2020-09-29
- Inventor: Benjamin W. Mooring , Damon Tyrone Genetti
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Penilla IP, APC
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/68 ; H01L21/67

Abstract:
Each sensor in an array of sensors detects and signals when an edge of a wafer passes by the sensor on a wafer handling component of a robot. A number (N) of detected wafer edge locations is determined. Each detected wafer edge location is a set of coordinates (x, y) in a coordinate system of the wafer handling component. For each unique set of (N−1) of the number (N) of detected wafer edge locations, an estimated wafer offset is determined that substantially minimizes a performance index value. The estimated wafer offset is a vector extending from a center of the coordinate system of the wafer handling component to an estimated center location of the wafer. A final wafer offset is identified as the estimated wafer offset that has a smallest corresponding performance index value. The final wafer offset is used to center the wafer at a target station.
Public/Granted literature
- US20200091085A1 Fiducial-Filtering Automatic Wafer Centering Process and Associated System Public/Granted day:2020-03-19
Information query
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