Invention Grant
- Patent Title: Methods for enhancing adhesion of three-dimensional structures to substrates
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Application No.: US16013237Application Date: 2018-06-20
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Publication No.: US10790251B2Publication Date: 2020-09-29
- Inventor: Christopher J. Gambee , Nhi Doan , Chandra S. Tiwari , Owen R. Fay , Ying Chen
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/027 ; H01L21/56
Abstract:
Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
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