公开(公告)号：US10790251B2

公开(公告)日：2020-09-29

申请号：US16013237

申请日：2018-06-20

Applicant: Micron Technology, Inc.

Inventor： Christopher J. Gambee ,  Nhi Doan ,  Chandra S. Tiwari ,  Owen R. Fay ,  Ying Chen

IPC: H01L23/00 ,  H01L21/027 ,  H01L21/56

Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.

公开(公告)号：US11276658B2

公开(公告)日：2022-03-15

申请号：US16987223

申请日：2020-08-06

Applicant: Micron Technology, Inc.

Inventor： Christopher J. Gambee ,  Nhi Doan ,  Chandra S. Tiwari ,  Owen R. Fay ,  Ying Chen

IPC: H01L23/00 ,  H01L21/027 ,  H01L21/56

Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.

公开(公告)号：US20190393176A1

公开(公告)日：2019-12-26

申请号：US16013237

申请日：2018-06-20

Applicant: Micron Technology, Inc.

Inventor： Christopher J. Gambee ,  Nhi Doan ,  Chandra S. Tiwari ,  Owen R. Fay ,  Ying Chen

IPC: H01L23/00 ,  H01L21/027 ,  H01L21/56

Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.