Invention Grant
- Patent Title: Laser processing method and laser processing apparatus
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Application No.: US14911663Application Date: 2015-01-26
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Publication No.: US10792759B2Publication Date: 2020-10-06
- Inventor: Saneyuki Goya , Masato Kinouchi , Atsushi Takita , Minoru Danno , Toshiya Watanabe , Takashi Ishide
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@d389616
- International Application: PCT/JP2015/052072 WO 20150126
- International Announcement: WO2015/129362 WO 20150309
- Main IPC: B23K26/0622
- IPC: B23K26/0622 ; B23K26/40 ; B23K26/382 ; B23K26/06 ; B23K26/388 ; B23K103/16 ; B23K26/356 ; B23K101/00

Abstract:
Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
Public/Granted literature
- US20160193693A1 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS Public/Granted day:2016-07-07
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