公开(公告)号：US09757816B2

公开(公告)日：2017-09-12

申请号：US14655281

申请日：2013-11-22

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Yoshihito Fujita ,  Tsugumaru Yamashita ,  Saneyuki Goya ,  Makoto Yamasaki ,  Ryu Suzuki ,  Kohei Kanaoka ,  Takashi Ishide ,  Toshiya Watanabe

IPC: B23K26/00 ,  B23K26/03 ,  B23K26/14 ,  B23K26/046 ,  B23K26/06 ,  B23K26/34 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K26/26 ,  B23K103/04 ,  B23K103/08 ,  B23K103/14 ,  B23K103/16 ,  B23K103/00 ,  B23K103/18

CPC classification number: B23K26/032 ,  B23K26/00 ,  B23K26/046 ,  B23K26/06 ,  B23K26/0652 ,  B23K26/14 ,  B23K26/26 ,  B23K26/34 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/14 ,  B23K2103/16 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52

Abstract: Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; and the irradiation head (16) can be divided into a collimate optical system, a laser revolving unit (35), and a light collection optical system (37). The laser revolving unit (35) has a first prism (51), a second prism (52), a first rotation mechanism (53), and a second rotation mechanism (54). The controller controls the rotational speeds and the difference in phase angles of the first prism (51) and the second prism (52), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.

公开(公告)号：US09862055B2

公开(公告)日：2018-01-09

申请号：US14770015

申请日：2013-11-22

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Minoru Danno ,  Toshiya Watanabe ,  Takashi Ishide ,  Tsugumaru Yamashita ,  Yoshihito Fujita ,  Makoto Yamasaki ,  Ryu Suzuki ,  Kohei Kanaoka

IPC: B23K26/064 ,  B23K26/082 ,  B23K26/21 ,  B23K26/352 ,  B23K26/36 ,  B23K26/06 ,  B23K26/38

CPC classification number: B23K26/0652 ,  B23K26/082 ,  B23K26/36 ,  B23K26/38

Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

公开(公告)号：US10792759B2

公开(公告)日：2020-10-06

申请号：US14911663

申请日：2015-01-26

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Masato Kinouchi ,  Atsushi Takita ,  Minoru Danno ,  Toshiya Watanabe ,  Takashi Ishide

IPC: B23K26/0622 ,  B23K26/40 ,  B23K26/382 ,  B23K26/06 ,  B23K26/388 ,  B23K103/16 ,  B23K26/356 ,  B23K101/00

Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.

公开(公告)号：US10442032B2

公开(公告)日：2019-10-15

申请号：US15300207

申请日：2015-01-26

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Saneyuki Goya ,  Kenji Muta ,  Toshiya Watanabe ,  Takashi Ishide

IPC: B23K26/062 ,  B23K26/082 ,  B23K26/21 ,  B23K26/32 ,  B23K26/342 ,  H01S5/042 ,  B23K26/40 ,  H01S5/024 ,  H01S5/42 ,  H01S5/00 ,  H01S5/40 ,  B23K26/0622 ,  B23K26/38 ,  B23K26/08 ,  B23K26/34 ,  B23K103/04

Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.