公开(公告)号：US12103110B2

公开(公告)日：2024-10-01

申请号：US16774261

申请日：2020-01-28

申请人： VIA MECHANICS, LTD.

发明人： Atsushi Sakamoto ,  Masaru Futaana ,  Takeshi Satoh ,  Yusuke Takegawa

IPC分类号： B23K26/388 ,  B23K26/06 ,  B23K26/064 ,  B23K26/073 ,  B23K26/082 ,  B23K26/40 ,  B23K103/18 ,  G02B19/00 ,  G02B26/08 ,  G02B26/10 ,  G02F1/33

CPC分类号： B23K26/388 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/073 ,  B23K26/0821 ,  B23K26/40 ,  G02B26/0816 ,  G02B26/105 ,  G02F1/33 ,  B23K2103/18 ,  G02B19/0009 ,  G02B19/0047

摘要： A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.

公开(公告)号：US10221086B2

公开(公告)日：2019-03-05

申请号：US14437027

申请日：2014-09-30

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Dai Dong ,  Weigang Gong ,  Yang Huang ,  Sheng Tao

IPC分类号： C03B33/09 ,  C03B33/02 ,  B23K26/03 ,  B23K26/142 ,  B23K26/388 ,  B23K26/70 ,  C03B33/04 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K26/0622 ,  B23K103/00

摘要： The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

公开(公告)号：US10131019B2

公开(公告)日：2018-11-20

申请号：US15853098

申请日：2017-12-22

申请人： AMADA HOLDINGS CO., LTD.

发明人： Shoichi Imaya

IPC分类号： B23K26/388 ,  B23K26/00 ,  B23K26/142 ,  B23K26/08 ,  G05B19/18 ,  B23K26/382 ,  B23K26/16 ,  B23K26/38 ,  B23Q7/00

摘要： A laser processing machine for carrying out hole-forming on a plate-shaped workpiece is provided. A first program storage that stores a plurality of hole-forming programs and a second program storage that stores a plurality of cutout piece drop programs are also provided. A program selector that selects, from the second program storage, a cutout piece drop program associated with a hole-forming program selected from the first program storage to form the hole on the workpiece. A working head controller that controls a laser processing head according to the hole-forming program and the cutout piece drop program that are selected is also provided. A motion path of the processing head after forming the hole on the workpiece and a jetting condition of assist gas to an inside of the outline from the processing head on the motion path are programmed in each of the plurality of cutout piece drop programs.

公开(公告)号：US20180071865A1

公开(公告)日：2018-03-15

申请号：US15409226

申请日：2017-01-18

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Chun-Ming CHEN ,  Min-Kai LEE ,  Chun-Ping JEN

IPC分类号： B23K26/16 ,  B23K26/388 ,  B23K37/08

CPC分类号： B23K26/16 ,  B23K26/142 ,  B23K26/388 ,  B23K26/389 ,  B23K37/08

摘要： A laser machining device includes a laser generating component, a light moving component, a gas source and a laser machining scrap removal device. The laser generating component generates a laser beam passing through an optical channel. The light moving component is positioned along a path of the laser beam to make the laser beam move along an annular machining path. The laser machining scrap removal device utilizes an internal flow path of the nozzle to increase the speed of the ejected airflow and reduce the pressure of a suction area. The gas source provides an airflow and is located on the laser machining scrap removal device in communication with the internal flow path of the nozzle. The laser machining scrap removal device induces suction on the laser processed area to assist in laser cutting/drilling processes by removing large areas of scrap, thereby improving the production speed and hole quality.

公开(公告)号：US20170225271A1

公开(公告)日：2017-08-10

申请号：US15500824

申请日：2015-08-06

申请人： BAE SYSTEMS plc

发明人： DARREN JAMES GOODMAN ,  ALLAN CHARLES GRIMALDI

IPC分类号： B23K26/388 ,  H05K3/00 ,  B23K26/402

CPC分类号： B23K26/388 ,  B23K26/389 ,  B23K26/402 ,  B23K2101/36 ,  B23K2103/50 ,  B23K2103/52 ,  H05K3/0029 ,  H05K3/0032 ,  H05K2201/09827 ,  H05K2203/081

摘要： The invention relates to a method of forming a void with a circular cross section in a substrate, more particularly to forming through holes electronic substrates The method comprising the steps of causing a laser cutter to traverse in an arc to an intended circumference of the void, traversing the intended circumference of the void at least once, wherein the lead in from the arc to the circumference comprises a radius.

公开(公告)号：US09696035B2

公开(公告)日：2017-07-04

申请号：US13875150

申请日：2013-05-01

申请人： General Electric Company

发明人： John Howard Starkweather ,  William Bennett ,  John Gibbons ,  Anthony Urbanski

IPC分类号： B23K26/388 ,  B23K26/384 ,  F23R3/00 ,  F23M5/08 ,  F23R3/04 ,  F23R3/06 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/382

CPC分类号： F23R3/002 ,  B23K26/0622 ,  B23K26/384 ,  B23K26/388 ,  B23K26/389 ,  B23K26/55 ,  F23M5/08 ,  F23R3/04 ,  F23R3/06 ,  F23R2900/00018 ,  F23R2900/03041 ,  Y02T50/675

摘要： A method for making shaped cooling holes in a substrate by pulsing and stopping a laser while moving the laser or substrate. The method produces shaped cooling holes with a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension.

公开(公告)号：US3576965A

公开(公告)日：1971-05-04

申请号：US3576965D

申请日：1968-09-13

申请人： LASER TECH SA

发明人： GUGGER GOTTFRIED

IPC分类号： B23K26/02 ,  B23K26/08 ,  B23K26/082 ,  B23K26/382 ,  B23K26/388 ,  B23K26/40 ,  B28D1/22 ,  G04D3/00 ,  B23K9/00

CPC分类号： B23K26/08 ,  B23K26/02 ,  B23K26/082 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2203/50 ,  B28D1/221 ,  G04D3/0071

摘要： A method and device for producing bores of substantially circular cross section in workpieces, particularly in watch jewels, by means of laser pulses, wherein a number of laser pulses successively produced by a laser source are directed into an optical deflecting system wherein the laser beam is deflected from its axis of incidence, successive laser pulses being thereby distributed by said rotating deflecting system on a path round the axis of the bore to be produced.

公开(公告)号：US10856965B2

公开(公告)日：2020-12-08

申请号：US16143932

申请日：2018-09-27

申请人： Medtronic Vascular, Inc.

发明人： Zachary Borglin ,  Keith Perkins ,  Darren Galligan ,  Julie Benton

IPC分类号： A61F2/06 ,  D04H1/485 ,  A61F2/07 ,  D02G3/36 ,  A61L27/58 ,  D03D1/00 ,  D03D15/00 ,  D02G3/44 ,  A61F2/00 ,  A61L27/18 ,  A61L27/54 ,  A61L27/56 ,  A61L31/14 ,  A61L31/16 ,  A61L31/02 ,  A61L31/06 ,  A61L31/10 ,  B23K26/388 ,  A61L31/04

摘要： A needle lattice is used to form openings within a graft material to selectively enhance permeability of a prosthesis for tissue integration therein. The needle lattice may be disposed on, for example, a surface of a roller or press. The needle lattice precisely places openings in any pattern and location, and on any textile that forms the graft material. The needle lattice can be heated to fuse the surrounding material of the openings of the textile to prevent movement of the textiles and to prevent collapse of the openings. All parameters of the openings, including varying density, patterns, and size of each opening, can be controlled, allowing for the opportunity to selectively enhance and optimize the permeability of the graft material in a vessel. The needle lattice can quickly form multiple openings within a graft material, allowing for quick manufacturing of the prosthesis.

公开(公告)号：US10221026B2

公开(公告)日：2019-03-05

申请号：US14663902

申请日：2015-03-20

申请人： The Procter & Gamble Company

发明人： Klaus Eimann ,  Christian Gehret ,  Sven Penirschke

IPC分类号： B65H5/22 ,  A46D3/08 ,  B23K26/388 ,  B65G51/02

摘要： A transportation device for transferring bristles from one location to another location comprises a tube system and a baffle plate comprising conically shaped vents. The baffle plate is arranged at one end of the tube system in order to stop the movement of the bristles transported inside the tube system using airflow. Such a transportation system may be part of a device for automated production of brushes, in particular toothbrushes. A plurality of bristles can be transferred by such transportation system in order to be arranged in a pre-defined bristle pattern corresponding to a bristle field of a brush, in particular a tooth brush.

公开(公告)号：US20190039178A1

公开(公告)日：2019-02-07

申请号：US16072970

申请日：2017-01-24

申请人： DENSO CORPORATION

发明人： Hideaki SHIRAI ,  Koichiro YASUDA

IPC分类号： B23K26/06 ,  B23K26/073 ,  B23K26/388

摘要： A method for manufacturing a member having a through hole includes a primary formation step, an intensity determination step, a laser modulation step, and a secondary formation step. The primary formation step includes radiating a laser beam to a workpiece member to form a pilot hole having a smaller inner diameter than the through hole while receiving light from the workpiece member at a light detection unit. The intensity determination step includes determining whether a light intensity is equal to or less than a predetermined threshold value. The laser modulation step includes modulating a spatial light phase of the laser beam the intensity of the light is equal to or less than the predetermined threshold value. The secondary formation step includes radiating the laser beam having the modulated spatial light phase to a peripheral part of the pilot hole to form the through hole.