Invention Grant
- Patent Title: Apparatus for semiconductor package inspection
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Application No.: US16473777Application Date: 2017-03-17
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Publication No.: US10794840B2Publication Date: 2020-10-06
- Inventor: Liang Zhang , Jianyong Mo , Darren A. Vance , Di Xu , Gregory S. Clemons , Robert F. Wiedmaier
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/023022 WO 20170317
- International Announcement: WO2018/169551 WO 20180920
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G01N21/88 ; G02B3/14 ; G06T7/00 ; H04N5/225

Abstract:
Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20190339212A1 AN APPARATUS FOR SEMICONDUCTOR PACKAGE INSPECTION Public/Granted day:2019-11-07
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