公开(公告)号：US10401286B1

公开(公告)日：2019-09-03

申请号：US15934722

申请日：2018-03-23

Applicant: Intel Corporation

Inventor： Jianyong Mo ,  Darren Vance ,  Di Xu ,  Liang Zhang

IPC: G01N21/55 ,  G06T7/00 ,  G06T1/00 ,  G01N21/17

Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.

公开(公告)号：US20230417987A1

公开(公告)日：2023-12-28

申请号：US17849557

申请日：2022-06-24

Applicant: Intel Corporation

Inventor： Wesley B. Morgan ,  Stephen A. Smith ,  Stephanie J. Arouh ,  Fan Fan ,  Jianyong Mo ,  Henry V. Wladkowski

IPC: G02B6/122 ,  G02B6/38 ,  G02B6/36 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B6/3885 ,  G02B6/3853 ,  G02B6/3636 ,  G02B6/12004 ,  G02B2006/12102

Abstract: Technologies for expanded beam optical connectors are disclosed. In an illustrative embodiment, a lens array attached to a substrate includes several lenses aligned to optical fibers positioned in grooves in the substrate. The lens array also includes optical fiducials, such as opaque optical fiducials. Auxiliary optical fibers are aligned to the optical fiducials. Light can be sent through the auxiliary optical fibers and onto the optical fiducials, and a pattern of light can be detected after the optical fiducials. The pattern of light can be used to determine a position and/or orientation error of the lens array. The error can be used as feedback in several possible ways, such as repositioning the lens array, positioning a guide pin to match the position and direction of beams through the lenses, or adjusting a parameter of a manufacturing process.

公开(公告)号：US20240332155A1

公开(公告)日：2024-10-03

申请号：US18194550

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： Jianyong Mo ,  Jason Michael Gamba ,  Liang Zhang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L23/481 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L23/15 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/92244

Abstract: Substrates with a glass core and glass buildup layers, and methods of forming the same, are described herein. In one example, a substrate includes a glass core, glass layers above and below the glass core, conductive traces in the glass core and at least some of the glass layers, and conductive contacts on a surface of the substrate.

公开(公告)号：US11913772B2

公开(公告)日：2024-02-27

申请号：US17696980

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Jianyong Mo ,  V Wade Singleton ,  Yiren Wu ,  Liang Zhang ,  David Wasinger

IPC: G01B11/06 ,  G01B11/30

CPC classification number: G01B11/06 ,  G01B11/30

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.

公开(公告)号：US12216301B2

公开(公告)日：2025-02-04

申请号：US17706654

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Jacob Chesna ,  Liang Zhang ,  Jianyong Mo ,  Fan Fan

IPC: G02B5/30 ,  G01L1/24 ,  G02B5/20 ,  G02B5/26

Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.

公开(公告)号：US20250004203A1

公开(公告)日：2025-01-02

申请号：US18342289

申请日：2023-06-27

Applicant: Intel Corporation

Inventor： Jianyong Mo ,  Fan Fan ,  Liang Zhang

IPC: G02B6/26 ,  G02B3/00

Abstract: Technologies for beam expansion in monolithic glass substrates are disclosed. In an illustrative embodiment, lenses in a glass substrate may be formed using a laser, either by changing the index of refraction or as part of a two-step etching process. A seam may be prepared and etched, separating the glass substrate into two components, one of which will be part of an optical plug and one of which will be part of an optical receptacle. The optical plug has a cavity into which an optical fiber can be placed. In use, the lens in the glass substrate of the optical plug collimates light from the optical fiber into a beam. When the optical plug is mated with the optical receptacle, the beam is aligned to the lens and a waveguide in the optical receptacle. The large size of the beam relaxes the alignment tolerance for the optical plug and receptacle.

公开(公告)号：US11644757B2

公开(公告)日：2023-05-09

申请号：US16721786

申请日：2019-12-19

Applicant: Intel Corporation

Inventor： Changhua Liu ,  Jianyong Mo ,  Liang Zhang

IPC: G03F7/20 ,  B81B1/00 ,  B81C1/00

CPC classification number: G03F7/70733 ,  B81B1/00 ,  B81C1/00111 ,  G03F7/201 ,  B81B2203/0361 ,  B81C2201/0159

Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

公开(公告)号：US10794840B2

公开(公告)日：2020-10-06

申请号：US16473777

申请日：2017-03-17

Applicant: Intel Corporation

Inventor： Liang Zhang ,  Jianyong Mo ,  Darren A. Vance ,  Di Xu ,  Gregory S. Clemons ,  Robert F. Wiedmaier

IPC: G01N21/956 ,  G01N21/88 ,  G02B3/14 ,  G06T7/00 ,  H04N5/225

Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.