Invention Grant
- Patent Title: Methods for depositing polymer layer for sensor applications via hot wire chemical vapor deposition
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Application No.: US15833552Application Date: 2017-12-06
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Publication No.: US10794853B2Publication Date: 2020-10-06
- Inventor: Colin Neikirk , Yuriy Melnik , Pravin K. Narwankar
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: G01N27/414
- IPC: G01N27/414 ; C23C16/46 ; C23C16/52 ; H01L23/29 ; H01L21/56 ; H01L21/285 ; H01L21/312 ; H01L21/47 ; H01L21/02 ; C23C16/448

Abstract:
The present disclosure relates to a method of depositing a polymer layer, including: providing a substrate, having a sensor structure disposed on the substrate, to a substrate support within a hot wire chemical vapor deposition (HWCVD) chamber; providing a process gas comprising an initiator gas and a monomer gas and a carrier gas to the HWCVD chamber; heating a plurality of filaments disposed in the HWCVD chamber to a first temperature sufficient to activate the initiator gas without decomposing the monomer gas; and exposing the substrate to initiator radicals from the activated initiator gas and to the monomer gas to deposit a polymer layer atop the sensor structure.
Public/Granted literature
- US20180164245A1 METHODS FOR DEPOSITING POLYMER LAYER FOR SENSOR APPLICATIONS VIA HOT WIRE CHEMICAL VAPOR DEPOSITION Public/Granted day:2018-06-14
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