Invention Grant
- Patent Title: Electronic device manufacturing systems, methods, and apparatus for heating substrates and reducing contamination in loadlocks
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Application No.: US15462203Application Date: 2017-03-17
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Publication No.: US10796935B2Publication Date: 2020-10-06
- Inventor: Adam J. Wyatt , Edward Ng , Andrew Nguyen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
An electronic device manufacturing system may include a loadlock. The loadlock may include a plurality of gas line heaters for providing a heated gas to the loadlock to heat a processed substrate therein. Heating a processed substrate may reduce corrosion in the loadlock and subsequent contamination of substrates therein. The loadlock may also include a plurality of embedded heaters in the loadlock housing to reduce moisture therein, further reducing corrosion and contamination. Methods of heating a substrate in a loadlock are also provided, as are other aspects.
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