公开(公告)号：US20180124960A1

公开(公告)日：2018-05-03

申请号：US15336279

申请日：2016-10-27

Applicant: Applied Materials, Inc.

Inventor： Joseph Vincent ,  Michael Kuchar ,  Dean C. Hruzek ,  Vijayabaskar Soundarrajan ,  Pandu Maddherla ,  Adam J. Wyatt ,  Robert M. McAndrew

IPC: H05K13/02 ,  H05K7/20 ,  H05K7/14

CPC classification number: H05K13/021 ,  H01L21/67126 ,  H01L21/67201 ,  H05K7/1401 ,  H05K7/20209

Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.

公开(公告)号：USD992611S1

公开(公告)日：2023-07-18

申请号：US29859229

申请日：2022-11-08

Applicant: Applied Materials, Inc.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

Abstract: FIG. 1 is a top perspective view of a mainframe for substrate processing system of the present design.
FIG. 2 is a side view thereof.
FIG. 3 is a side view thereof.
FIG. 4 is a front view thereof.
FIG. 5 is a rear view thereof.
FIG. 6 is a top view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a top perspective view thereof, showing unclaimed components attached thereto.
The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.

公开(公告)号：USD991994S1

公开(公告)日：2023-07-11

申请号：US29859227

申请日：2022-11-08

Applicant: Applied Materials, Inc.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

Abstract: FIG. 1 is a top perspective view of a mainframe for substrate processing system of the present design.
FIG. 2 is a side view thereof.
FIG. 3 is a side view thereof.
FIG. 4 is a front view thereof.
FIG. 5 is a rear view thereof.
FIG. 6 is a top view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a top perspective view thereof, showing unclaimed components attached thereto.
The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.

公开(公告)号：USD973737S1

公开(公告)日：2022-12-27

申请号：US29758663

申请日：2020-11-17

Applicant: Applied Materials, Inc.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

公开(公告)号：US10159169B2

公开(公告)日：2018-12-18

申请号：US15336279

申请日：2016-10-27

Applicant: Applied Materials, Inc.

Inventor： Joseph Vincent ,  Michael Kuchar ,  Dean C. Hruzek ,  Vijayabaskar Soundarrajan ,  Pandu Maddherla ,  Adam J. Wyatt ,  Robert M. McAndrew

IPC: H05K13/02 ,  H01L21/67 ,  H05K7/14 ,  H05K7/20

Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.

公开(公告)号：USD973116S1

公开(公告)日：2022-12-20

申请号：US29758664

申请日：2020-11-17

Applicant: Applied Materials, Inc.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

公开(公告)号：US10796935B2

公开(公告)日：2020-10-06

申请号：US15462203

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Adam J. Wyatt ,  Edward Ng ,  Andrew Nguyen

IPC: H01L21/67

Abstract: An electronic device manufacturing system may include a loadlock. The loadlock may include a plurality of gas line heaters for providing a heated gas to the loadlock to heat a processed substrate therein. Heating a processed substrate may reduce corrosion in the loadlock and subsequent contamination of substrates therein. The loadlock may also include a plurality of embedded heaters in the loadlock housing to reduce moisture therein, further reducing corrosion and contamination. Methods of heating a substrate in a loadlock are also provided, as are other aspects.

公开(公告)号：USD1029066S1

公开(公告)日：2024-05-28

申请号：US29830396

申请日：2022-03-11

Applicant: APPLIED MATERIALS, INC.

Designer： Michael R. Rice ,  Michael C. Kuchar ,  Travis Morey ,  Adam J. Wyatt ,  Ofer Amir

Abstract: FIG. 1 is a front, top perspective view of a mainframe for a dual-robot substrate processing system in accordance with the present design.
FIG. 2 is a left side elevational view of the present design.
FIG. 3 is a right side elevational view of the present design.
FIG. 4 is a front elevational view of the present design.
FIG. 5 is a rear elevational view of the present design.
FIG. 6 is a top plan view of the present design.
FIG. 7 is a bottom plan view of the second embodiment of the present design; and,
FIG. 8 is a front, top perspective view of the present design, showing unclaimed components attached thereto.
The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.

公开(公告)号：US20180270910A1

公开(公告)日：2018-09-20

申请号：US15462203

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Adam J. Wyatt ,  Edward Ng ,  Andrew Nguyen

IPC: H05B3/62 ,  H01L21/67 ,  H01L21/324

Abstract: An electronic device manufacturing system may include a loadlock. The loadlock may include a plurality of gas line heaters for providing a heated gas to the loadlock to heat a processed substrate therein. Heating a processed substrate may reduce corrosion in the loadlock and subsequent contamination of substrates therein. The loadlock may also include a plurality of embedded heaters in the loadlock housing to reduce moisture therein, further reducing corrosion and contamination. Methods of heating a substrate in a loadlock are also provided, as are other aspects.