Invention Grant
- Patent Title: Method for making a flexible wearable circuit
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Application No.: US15780327Application Date: 2015-12-11
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Publication No.: US10798817B2Publication Date: 2020-10-06
- Inventor: Aleksandar Aleksov , Javier Soto Gonzalez , Meizi Jiao , Shruti R. Jaywant , Oscar Ojeda , Sashi S. Kandanur , Srinivas Venkata Ramanuja Pietambaram , Roy Dittler , Rajat Goyal , Dilan Seneviratne
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2015/065257 WO 20151211
- International Announcement: WO2017/099795 WO 20170615
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46 ; H01L23/538 ; H01L21/48 ; H05K1/11 ; H05K1/18 ; H05K3/06 ; H05K3/30 ; H05K3/40 ; H05K3/28

Abstract:
Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.
Public/Granted literature
- US20180376585A1 MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WEARABLE ELECTRONICS Public/Granted day:2018-12-27
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