Invention Grant
- Patent Title: Component mounting method
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Application No.: US15785516Application Date: 2017-10-17
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Publication No.: US10798859B2Publication Date: 2020-10-06
- Inventor: Hideki Sumi
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6764cc52
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04 ; H05K13/00
Abstract:
A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.
Public/Granted literature
- US20180124962A1 COMPONENT MOUNTING METHOD Public/Granted day:2018-05-03
Information query
