Method for manufacturing mounting substrate, and component mounting device

    公开(公告)号:US12289836B2

    公开(公告)日:2025-04-29

    申请号:US17637101

    申请日:2020-06-09

    Abstract: A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

    Component mounting method
    2.
    发明授权

    公开(公告)号:US10798859B2

    公开(公告)日:2020-10-06

    申请号:US15785516

    申请日:2017-10-17

    Inventor: Hideki Sumi

    Abstract: A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.

    Component mounting method
    3.
    发明授权

    公开(公告)号:US10045470B2

    公开(公告)日:2018-08-07

    申请号:US14799814

    申请日:2015-07-15

    Inventor: Hideki Sumi

    Abstract: A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two transport lanes. The board distributing apparatus distributes the board to any one of the two transport lanes based on a presence or absence of boards in the carry-in area and the mounting area.

    Component mounting method in component mounting system

    公开(公告)号:US10015920B2

    公开(公告)日:2018-07-03

    申请号:US15140120

    申请日:2016-04-27

    Inventor: Hideki Sumi

    Abstract: An external set-up device calculates a shift amount of a supply position of a component which is supplied by a tape feeder that is disposed on the carriage. The storage stores supply position shifting data in which the shift amount of the component supply position is related to a feeder address and a feeder ID. The component mounter compares the feeder ID of the tape feeder with the feeder ID included in the component supply position shifting data which is read from the storage, and, in a case in which the feeder IDs do not match, calculates the shift amount of the component supply position of the corresponding tape feeder and updates the supply position shifting data. The component mounter mounts the components onto a board based on the updated component supply position shifting data.

    Component mounting method
    5.
    发明授权

    公开(公告)号:US09908719B2

    公开(公告)日:2018-03-06

    申请号:US14694298

    申请日:2015-04-23

    Inventor: Hideki Sumi

    Abstract: A suction failure recovering process of a component mounting method includes: executing an imaging process in which an image of a pitch-fed pocket of a carrier tape is obtained; executing a pocket position detection process in which a pocket position is detected; and executing a positional displacement determination process in which it is determined whether the detected pocket position falls into a permissible range or not. When it is determined that the pocket position does not fall into the permissible range, the imaging process, the pocket position detection process and the positional displacement determination process are executed sequentially and repeatedly until the pocket position falls into the permissible range. When it is determined that the pocket position falls into the permissible range, a suction position is corrected based on the pocket position at a time point at which the pocket position falls into the permissible range.

    Component mounting method
    6.
    发明授权

    公开(公告)号:US09999169B2

    公开(公告)日:2018-06-12

    申请号:US15017170

    申请日:2016-02-05

    Inventor: Hideki Sumi

    CPC classification number: H05K13/0413 H05K13/0417 H05K13/08 H05K13/081

    Abstract: A component mounting method performs suction and holing, by a suction nozzle, of a component fed to a component picking-up position by a tape feeder which feeds by pitch a carrier tape having a pocket in which the component is accommodated, after a predetermined delay time elapses after a pitch feeding timing, and carries and mounts the component on a board. The component mounting method includes imaging a tape position indicating portion at separate two timings after the delay time elapses, and calculating a shift amount between a first and second tape positions respectively obtained at first and second timings of imaging. It is determined whether or not the shift amount calculated is within an allowable range, and when it is determined that the shift amount exceeds the allowable range, the delay time set for the tape feeder is extended or an error is notified.

    Manufacturing system and method of granting authority

    公开(公告)号:US11029672B2

    公开(公告)日:2021-06-08

    申请号:US16142099

    申请日:2018-09-26

    Inventor: Hideki Sumi

    Abstract: A manufacturing system includes a plurality of manufacturing facilities, a remote terminal, and a remote authority controller that controls authority of a remote operation from the remote terminal. When an error is detected in a first manufacturing facility out of the plurality of manufacturing facilities, the remote authority controller grants authority of a remote operation of a second manufacturing facility to the remote terminal. The second manufacturing facility causes the error and is other than the first manufacturing facility.

    Component mounting method
    9.
    发明授权

    公开(公告)号:US10308444B2

    公开(公告)日:2019-06-04

    申请号:US14694298

    申请日:2015-04-23

    Inventor: Hideki Sumi

    CPC classification number: B65G47/917

    Abstract: A suction failure recovering process of a component mounting method includes: executing an imaging process in which an image of a pitch-fed pocket of a carrier tape is obtained; executing a pocket position detection process in which a pocket position is detected; and executing a positional displacement determination process in which it is determined whether the detected pocket position falls into a permissible range or not. When it is determined that the pocket position does not fall into the permissible range, the imaging process, the pocket position detection process and the positional displacement determination process are executed sequentially and repeatedly until the pocket position falls into the permissible range. When it is determined that the pocket position falls into the permissible range, a suction position is corrected based on the pocket position at a time point at which the pocket position falls into the permissible range.

    Method of upgrading version of program in component mounting line

    公开(公告)号:US10278320B2

    公开(公告)日:2019-04-30

    申请号:US15645409

    申请日:2017-07-10

    Inventor: Hideki Sumi

    Abstract: A method of upgrading a version of a program of the present disclosure executes version upgrade of the program of a plurality of component mounting facilities sequentially from a first component mounting facility of the plurality of component mounting facilities to the plurality of component mounting facilities on a downstream side in a component mounting line in which the plurality of component mounting facilities are connected to each other. The first component mounting facility completes mounting of a board under production at the time of receiving an instruction for executing version upgrade and executes the version upgrade after carrying-out of the board to an adjacent component mounting facility is completed among the plurality of component mounting facilities on the downstream side.

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