- 专利标题: Adhesive composition
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申请号: US16533207申请日: 2019-08-06
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公开(公告)号: US10800953B2公开(公告)日: 2020-10-13
- 发明人: So Young Kim , Seung Min Lee , Jung Sup Shim , Se Woo Yang
- 申请人: LG CHEM, LTD.
- 申请人地址: KR Seoul
- 专利权人: LG CHEM., LTD.
- 当前专利权人: LG CHEM., LTD.
- 当前专利权人地址: KR Seoul
- 代理机构: Dentons US LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4fec33a1
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L31/111 ; C09J123/22 ; B33Y70/00 ; C08L33/04 ; C08L63/00 ; C08L75/04 ; C08L101/02 ; H01L51/00
摘要:
Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and excellent reliability at high temperature and high humidity, and an OED including the same.
公开/授权文献
- US20190359863A1 ADHESIVE COMPOSITION 公开/授权日:2019-11-28
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