- 专利标题： Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
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申请号： US16680649申请日： 2019-11-12
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公开(公告)号： US10818582B2公开(公告)日： 2020-10-27
- 发明人: Aira Lourdes Villamor , Erwin Victor Cruz , Geraldine Suico , Silnore Sabando
- 申请人： FAIRCHILD SEMICONDUCTOR CORPORATION
- 申请人地址： US AZ Phoenix
- 专利权人： FAIRCHILD SEMICONDUCTOR CORPORATION
- 当前专利权人： FAIRCHILD SEMICONDUCTOR CORPORATION
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Brake Hughes Bellermann LLP
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L23/495 ; H01L23/492 ; H01L21/56 ; H01L21/48 ; H01L23/31
摘要：
In a general aspect, a method for producing a packaged semiconductor device can include coupling a semiconductor device to a leadframe structure having a signal lead that is electrically coupled with the semiconductor device. The method can also include forming, with a laser, a groove in the signal lead, the groove having a first sidewall and a second sidewall, and applying solder plating to the signal lead, including the first sidewall and the second sidewall of the groove. The method can further include separating, at the groove, the signal lead into a first portion and a second portion, such that the second portion of the signal lead is separated from the metal leadframe structure.
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