Invention Grant
- Patent Title: Flexible packaging for a wearable electronic device
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Application No.: US16335050Application Date: 2016-09-28
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Publication No.: US10820437B2Publication Date: 2020-10-27
- Inventor: Aleksandar Aleksov , Son V. Nguyen , Rajat Goyal , David B. Lampner , Dilan Seneviratne , Albert S. Lopez , Joshua D. Heppner , Srinivas V. Pietambaram , Shawna M. Liff , Nadine L. Dabby
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2016/054240 WO 20160928
- International Announcement: WO2018/063198 WO 20180405
- Main IPC: G06F17/30
- IPC: G06F17/30 ; H05K5/06 ; H05K5/00 ; H05K5/02 ; G06F1/18 ; G06F1/16 ; G04G17/04

Abstract:
The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.
Public/Granted literature
- US20190281717A1 FLEXIBLE PACKAGING FOR A WEARABLE ELECTRONIC DEVICE Public/Granted day:2019-09-12
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