Invention Grant
- Patent Title: Resin composition and cured resin composition
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Application No.: US16297265Application Date: 2019-03-08
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Publication No.: US10822517B2Publication Date: 2020-11-03
- Inventor: Tien-Shou Shieh , Pei-Hsin Chien
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2e71a487
- Main IPC: C09D163/00
- IPC: C09D163/00 ; C08G59/24 ; C09D7/47 ; C08G59/18

Abstract:
A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.
Public/Granted literature
- US20200165481A1 Resin composition and cured resin composition Public/Granted day:2020-05-28
Information query
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