Invention Grant
- Patent Title: Semiconductor packages and devices
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Application No.: US16021383Application Date: 2018-06-28
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Publication No.: US10825783B2Publication Date: 2020-11-03
- Inventor: Shing-Yih Shih , Tieh-Chiang Wu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/538
Abstract:
Some embodiments of the present disclosure disclose a method for forming semiconductor packages. The method includes disposing a plurality of semiconductor chips over a top side of a wafer, molding the plurality of semiconductor chips with a first molding material, and after molding the semiconductor chips, forming a composite layer over the plurality of semiconductor chips.
Public/Granted literature
- US20180315718A1 SEMICONDUCTOR PACKAGES AND DEVICES Public/Granted day:2018-11-01
Information query
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