Invention Grant
- Patent Title: Near-field transducer with thermally robust peg embedded into an enlarged portion
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Application No.: US16525918Application Date: 2019-07-30
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Publication No.: US10832717B1Publication Date: 2020-11-10
- Inventor: Yuhang Cheng , Nan Zhou , Yongjun Zhao , Huaqing Yin , Weibin Chen , Michael Allen Seigler
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Fremont
- Agency: Mueting Raasch Group
- Main IPC: G11B5/09
- IPC: G11B5/09 ; G11B5/60 ; G11B5/31 ; G11B5/00
Abstract:
A near-field transducer has an enlarged portion with a layer of soft plasmonic material. A peg formed of a thermally robust plasmonic material includes an embedded part that is partially embedded within the enlarged portion and has an exposed surface facing away from the enlarged portion. An intersection between a lower edge of the enlarged portion and the embedded part has a discontinuity.
Information query
IPC分类:
