Invention Grant
- Patent Title: Die attach methods and semiconductor devices manufactured based on such methods
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Application No.: US16518351Application Date: 2019-07-22
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Publication No.: US10832992B2Publication Date: 2020-11-10
- Inventor: Joachim Mahler , Giovanni Ragasa Garbin , Chen Wen Lee , Benjamin Reichert , Peter Strobel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@778c9b3
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/40 ; H01L23/495 ; H01L23/00
Abstract:
A method includes providing a carrier, depositing a die attach material on the carrier, and arranging a semiconductor die on the die attach material, wherein a main surface of the semiconductor die facing the die attach material at least partly contacts the die attach material, wherein immediately after arranging the semiconductor die on the die attach material, a first maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.
Information query
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