- 专利标题： Multi-chip fan out package and methods of forming the same
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申请号： US16209454申请日： 2018-12-04
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公开(公告)号： US10833039B2公开(公告)日： 2020-11-10
- 发明人: Chen-Hua Yu , Jing-Cheng Lin , Jui-Pin Hung
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/00 ; H01L23/538 ; H01L21/683 ; H01L23/31 ; H01L21/3105 ; H01L25/065 ; H01L25/00 ; H01L23/498 ; H01L23/544 ; H01L21/78
摘要：
A package includes a die having a conductive pad at a top surface of the die, a stud bump over and connected to the conductive pad, and a redistribution line over and connected to the stud bump. An electrical connector is over and electrically coupled to the redistribution line.
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