Invention Grant
- Patent Title: Metal deposition methods
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Application No.: US16597526Application Date: 2019-10-09
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Publication No.: US10851454B2Publication Date: 2020-12-01
- Inventor: Yong Wu , Srinivas Gandikota , Abhijit Basu Mallick
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/14
- IPC: C23C16/14 ; H01L21/285 ; C23C16/455
Abstract:
A method of forming conformal amorphous metal films is disclosed. A method of forming crystalline metal films with a predetermined orientation is also disclosed. An amorphous nucleation layer is formed on a substrate surface. An amorphous metal layer is formed from the nucleation layer by atomic substitution. A crystalline metal layer is deposited on the amorphous metal layer by atomic layer deposition.
Public/Granted literature
- US20200040448A1 METAL DEPOSITION METHODS Public/Granted day:2020-02-06
Information query
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