A semiconductor package may include a sensor chip to measure an amount of electrical current in a current medium. The sensor chip may include a first magnetic sensing element and a second magnetic sensing element. The semiconductor package may include a magnet that produces a magnetic field. The magnet may be arranged asymmetrically with respect to the first magnetic sensing element and the second magnetic sensing element such that a strength of the magnetic field at the first magnetic sensing element is different from a strength of the magnetic field at the second magnetic sensing element.