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公开(公告)号：US11561245B2
公开(公告)日：2023-01-24
申请号：US17217390
申请日：2021-03-30
摘要： A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.
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公开(公告)号：US20200335451A1
公开(公告)日：2020-10-22
申请号：US16835627
申请日：2020-03-31
发明人： Jochen Dangelmaier , Klaus Elian
IPC分类号： H01L23/544 , H01L21/67
摘要： A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
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公开(公告)号：US10802124B2
公开(公告)日：2020-10-13
申请号：US15390060
申请日：2016-12-23
发明人： Klaus Elian , Horst Theuss
IPC分类号： H01L41/00 , G01S7/521 , B81B7/00 , H01L41/09 , G01S15/08 , G01S15/10 , G10K11/00 , H01L41/053
摘要： Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
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公开(公告)号：US10571682B2
公开(公告)日：2020-02-25
申请号：US15674149
申请日：2017-08-10
发明人： Ludwig Heitzer , Derek Debie , Klaus Elian , Cyrus Ghahremani , Johannes Lodermeyer , Oskar Neuhoff , Johann Strasser
摘要： A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.
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公开(公告)号：US10451543B2
公开(公告)日：2019-10-22
申请号：US15349438
申请日：2016-11-11
摘要： A photo-acoustic gas sensor is disclosed. The photo-acoustic gas sensor includes a substrate, a light emitter unit supported by the substrate, the light emitter unit including a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit supported by the substrate, the detector unit including a microphone, wherein the beam of light pulses traverses an area intended to accommodate the gas and the microphone can receive a signal oscillating with the repetition frequency.
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6.发明授权公开(公告)号：US09927498B2
公开(公告)日：2018-03-27
申请号：US14297685
申请日：2014-06-06
CPC分类号： G01R33/06 , G01R33/0052 , H01L2224/48091 , H01L2924/181 , Y10T29/49021 , H01L2924/00012 , H01L2924/00014
摘要： In one implementation, a magnetic sensor device used for sensing a static or dynamic magnetic field includes a ring-shaped magnet, a sensor chip arranged in an opening of the ring-shaped magnet, and a leadframe, with the ring-shaped magnet and the sensor chip directly disposed on the leadframe. The sensor chip may further include a carrier with a stepwise configuration having two or more different planes with the ring-shaped magnet and the sensor chip disposed on different planes.
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公开(公告)号：US09818665B2
公开(公告)日：2017-11-14
申请号：US14193480
申请日：2014-02-28
发明人： Klaus Elian , Horst Theuss
IPC分类号： H01L23/31 , B29C67/00 , H01L21/56 , B29C70/72 , B33Y80/00 , B33Y40/00 , B81C1/00 , H01L21/48 , B29K25/00 , B29K33/04 , B29K105/00 , B29L31/34
CPC分类号： H01L23/3135 , B29C64/00 , B29C64/10 , B29C64/106 , B29C70/72 , B29K2025/08 , B29K2033/04 , B29K2105/253 , B29L2031/3481 , B33Y40/00 , B33Y80/00 , B81C1/00309 , B81C2203/0136 , H01L21/4867 , H01L21/56 , H01L23/3121 , H01L23/315 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49113 , H01L2924/00014 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099 , H01L2924/00
摘要： In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.
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公开(公告)号：US20170212036A1
公开(公告)日：2017-07-27
申请号：US15349438
申请日：2016-11-11
IPC分类号： G01N21/17
CPC分类号： G01N21/1702 , A61B5/0095 , A61B2562/0204 , G01N29/032 , G01N29/222 , G01N29/2418 , G01N29/48 , G01N33/0009 , G01N2021/1704 , G01N2291/021 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： A photo-acoustic gas sensor is disclosed. The photo-acoustic gas sensor includes a substrate, a light emitter unit supported by the substrate, the light emitter unit including a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit supported by the substrate, the detector unit including a microphone, wherein the beam of light pulses traverses an area intended to accommodate the gas and the microphone can receive a signal oscillating with the repetition frequency.
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公开(公告)号：US09631997B2
公开(公告)日：2017-04-25
申请号：US13893970
申请日：2013-05-14
发明人： Klaus Elian
CPC分类号： G01L19/0069 , G01L19/147 , G01L19/148
摘要： An apparatus for measuring a pressure includes a semiconductor die and a circuit board. The semiconductor die includes a micro-mechanical element generating a measurement signal indicating information on an external pressure applied to the micro-mechanical element. The semiconductor die further includes an output interface providing the measurement signal. The circuit board includes at least one electrically-conductive line and an opening. The semiconductor die is attached to the circuit board, so that the micro-mechanical element faces the whole of the circuit board and the at least on electrically-conductive line is connected to the output interface.
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公开(公告)号：US09601858B2
公开(公告)日：2017-03-21
申请号：US14590017
申请日：2015-01-06
发明人： Klaus Elian
CPC分类号： H01R13/405 , H01F1/083 , H01F1/113 , H01F41/0266 , H01L2224/48091 , H01L2224/48247 , H01R13/6205 , H01R13/6683 , H01L2924/00014
摘要： A magnet package is created, which includes a package body, wherein the package body is formed of a permanent magnetic material, and at least one electric contact, which is covered by the package body.
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