Invention Grant
- Patent Title: Embedded coil assembly and method of making
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Application No.: US15809750Application Date: 2017-11-10
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Publication No.: US10854370B2Publication Date: 2020-12-01
- Inventor: Haiying Li , Benjamin Michael Sutton , Ming Li
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F17/04 ; H01F17/06 ; H01F27/02 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
Public/Granted literature
- US20180336994A1 EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING Public/Granted day:2018-11-22
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