Invention Grant
- Patent Title: Method for producing ceramic substrate, ceramic substrate, and module
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Application No.: US16821232Application Date: 2020-03-17
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Publication No.: US10854385B2Publication Date: 2020-12-01
- Inventor: Kumiko Ishikawa , Seiji Fujita , Tsutomu Sasaki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2017-180249 20170920; JP2018-023074 20180213
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; H01G4/10

Abstract:
A method for producing a ceramic substrate that includes a substrate body having ceramic layers and columnar projecting electrodes on a first primary surface of the substrate body. The method includes a step of preparing electrode formation sheets for forming the projecting electrodes, a step of perforating the electrode formation sheets with through holes and filling the through holes with a first electrically conductive paste containing a first electrically conductive powder, a step of building a composite multilayer body by stacking ceramic green sheets and the electrode formation sheets on a first primary surface of the stack of ceramic green sheets. The first electrically conductive powder contains electrically conductive metal(s) and anti-sintering ceramic(s) that controls the sintering of particles of the electrically conductive metal(s), with at least part of the surface of the particles of the electrically conductive metal(s) covered with the anti-sintering ceramic(s).
Public/Granted literature
- US20200219652A1 METHOD FOR PRODUCING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND MODULE Public/Granted day:2020-07-09
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