Invention Grant
- Patent Title: Polishing method, polishing apparatus, and substrate processing system
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Application No.: US15909758Application Date: 2018-03-01
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Publication No.: US10854473B2Publication Date: 2020-12-01
- Inventor: Yu Ishii , Kenya Ito , Keisuke Uchiyama , Masayuki Nakanishi
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: JP2017-42131 20170306
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01L21/68 ; B24B37/10 ; B24B37/005 ; G06F9/06 ; H01L21/02
Abstract:
A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.
Public/Granted literature
- US20180254196A1 POLISHING METHOD, POLISHING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2018-09-06
Information query
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