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    POLISHING APPARATUS AND POLISHING METHOD
    2.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开

    公开(公告)号：US20180169822A1

    公开(公告)日：2018-06-21

    申请号：US15882462

    申请日：2018-01-29

    Applicant: Ebara Corporation

    Inventor： Masaya Seki ,  Tetsuji Togawa ,  Kenya Ito

    IPC: B24B21/00 ,  B24B49/00 ,  B24B21/02

    CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B21/00 ,  B24B21/004 ,  B24B21/02 ,  B24B27/0076 ,  B24B49/00 ,  B24B49/12

    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.

    Substrate processing apparatus
    3.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号：US09566616B2

    公开(公告)日：2017-02-14

    申请号：US14315283

    申请日：2014-06-25

    Applicant: EBARA CORPORATION

    Inventor： Tetsuji Togawa ,  Kenya Ito ,  Yu Ishii ,  Keisuke Uchiyama

    IPC: B08B1/04 ,  H01L21/304 ,  H01L21/687 ,  B08B1/00 ,  H01L21/67

    CPC classification number: B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

    Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

    Abstract translation: 公开了一种能够检测由流体支撑的诸如晶片的基板是否适当地存在于预定处理位置中的基板处理装置。 衬底处理装置包括至少一个距离传感器，其构造成测量洗涤器和静水支撑结构之间的距离; 以及处理控制器，被配置为从所述距离的测量值计算所述静液压支撑结构和所述基板的表面之间的间隙，并且确定所述间隙是否落在预定范围内。

    POLISHING APPARATUS AND POLISHING METHOD
    8.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 有权
    抛光装置和抛光方法

    公开(公告)号：US20150258653A1

    公开(公告)日：2015-09-17

    申请号：US14643529

    申请日：2015-03-10

    Applicant: Ebara Corporation

    Inventor： Masaya Seki ,  Tetsuji Togawa ,  Kenya Ito

    IPC: B24B21/00 ,  H01L21/304 ,  B24B49/00

    CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B21/00 ,  B24B21/004 ,  B24B21/02 ,  B24B27/0076 ,  B24B49/00 ,  B24B49/12

    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.

    Abstract translation: 根据实施例的抛光装置的抛光单元包括：抛光头，其具有构造成保持研磨带的按压构件，并且从上方将研磨带压靠在基板的周边部分; 磁带供给和恢复机构，被配置为将抛光带提供到抛光头并从抛光头回收抛光带; 第一移动机构，其构造成在所述基板的径向方向上移动所述抛光头; 以及第二移动机构，其构造成沿着所述基板的径向方向移动所述带供给和恢复机构。 定位单元包括具有接触表面的定位块，并且通过移动带供应和恢复机构的第二移动机构来导引研磨带的对准，使得研磨带的基板侧边缘与接触表面接触。

    Method for manufacturing semiconductor device
    9.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号：US08748289B2

    公开(公告)日：2014-06-10

    申请号：US13868500

    申请日：2013-04-23

    Applicant: Ebara Corporation

    Inventor： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

    IPC: H01L21/66 ,  H01L21/30 ,  H01L21/46 ,  H01L21/00

    CPC classification number: H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

    Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

    Abstract translation: 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    10.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号：US20130213437A1

    公开(公告)日：2013-08-22

    申请号：US13772031

    申请日：2013-02-20

    Applicant: Ebara Corporation ,  Kabushiki Kaisha Toshiba

    Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

    IPC: B08B1/00

    CPC classification number: B08B1/001 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68728

    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

    Abstract translation: 基板处理装置以高的去除效率从基板中去除异物。 基板处理装置包括：洗涤器，其通过使洗涤部件与基板的第一表面滑动接触来进行基板的表面处理;流体静力支撑机构，用于经由流体压力而不接触基板来支撑基板的第二表面 所述第二表面是所述第一表面的相对表面，用于清洁所述经处理的基底的清洁剂以及用于干燥所述经清洁的基底的干燥器。 洗涤器使洗涤构件与第一表面滑动接触，同时围绕洗涤器的中心轴旋转洗涤构件。

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