Chip package with cross-linked thermoplastic dielectric

Invention Grant

US10854547B2 Chip package with cross-linked thermoplastic dielectric 有权

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Patent Title: Chip package with cross-linked thermoplastic dielectric
Application No.: US16279370

Application Date: 2019-02-19
Publication No.: US10854547B2

Publication Date: 2020-12-01
Inventor: Joachim Mahler , Georg Meyer-Berg , Guenter Tutsch
Applicant: Infineon Technologies AG
Applicant Address: DE Neubiberg
Assignee: Infineon Technologies AG
Current Assignee: Infineon Technologies AG
Current Assignee Address: DE Neubiberg
Agency: Dicke, Billig & Czaja, PLLC
Priority: DE102018105731 20180313
Main IPC: H01L23/532
IPC: H01L23/532 ; H01L23/31 ; H01L23/495 ; H01L21/56 ; H01L25/07 ; H01L23/00

Chip package with cross-linked thermoplastic dielectric

Abstract:

A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

Public/Granted literature

US20190287907A1 CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE Public/Granted day:2019-09-19

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/52	.用于在处于工作中的器件内部从一个组件向另一个组件通电的装置
H01L23/522	..包含制作在半导体本体上的多层导电的和绝缘的结构的外引互连装置的
H01L23/532	...按材料特点进行区分的