Patent search ap:("Infineon Technologies AG") AND inv:"Guenter Tutsch" Page 1

1.

发明授权
Chip package with cross-linked thermoplastic dielectric 有权

公开(公告)号：US10854547B2

公开(公告)日：2020-12-01

申请号：US16279370

申请日：2019-02-19

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler , Georg Meyer-Berg , Guenter Tutsch

IPC: H01L23/532 , H01L23/31 , H01L23/495 , H01L21/56 , H01L25/07 , H01L23/00

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

2.

发明申请
CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE 审中-公开

公开(公告)号：US20190287907A1

公开(公告)日：2019-09-19

申请号：US16279370

申请日：2019-02-19

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler , Georg Meyer-Berg , Guenter Tutsch

IPC: H01L23/532 , H01L23/31 , H01L23/495 , H01L25/07 , H01L23/00 , H01L21/56

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

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