Invention Grant
- Patent Title: Integrated components which have both horizontally-oriented transistors and vertically-oriented transistors
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Application No.: US16379365Application Date: 2019-04-09
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Publication No.: US10854617B2Publication Date: 2020-12-01
- Inventor: Scott J. Derner , Charles L Ingalls
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11507
- IPC: H01L27/11507 ; H01L29/78 ; H01L23/528 ; H01L27/11514 ; H01L27/108 ; H01L29/08 ; H01L27/02 ; H01L49/02

Abstract:
Some embodiments include an integrated assembly. The integrated assembly has a first transistor with a horizontally-extending channel region between a first source/drain region and a second source/drain region; has a second transistor with a vertically-extending channel region between a third source/drain region and a fourth source/drain region; and has a capacitor between the first and second transistors. The capacitor has a first electrode, a second electrode, and an insulative material between the first and second electrodes. The first electrode is electrically connected with the first source/drain region, and the second electrode is electrically connected with the third source/drain region. A digit line is electrically connected with the second source/drain region. A conductive structure is electrically connected with the fourth source/drain region.
Public/Granted literature
Information query
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