A window assembly includes a first radio frequency device disposed between a first window substrate and a second window substrate. An embedded coplanar waveguide is disposed between the first window substrate and the second window substrate, and is attached to the first radio frequency device. An exterior coplanar waveguide is disposed adjacent an exterior side surface of the first window substrate, and is disposed opposite the embedded coplanar waveguide for communicating electromagnetic waves therebetween. A printed circuit board is attached to and interconnects the exterior coplanar waveguide and a radio frequency cable connector. The radio frequency cable connector is configured for connection to a second radio frequency device. An adhesive layer bonds the printed circuit board to the exterior side surface of the first window substrate.