Invention Grant
- Patent Title: Method of manufacturing semiconductor devices and corresponding semiconductor device
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Application No.: US16551272Application Date: 2019-08-26
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Publication No.: US10861760B2Publication Date: 2020-12-08
- Inventor: Federico Giovanni Ziglioli
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: IT102017000055983 20170523
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/3105 ; H01L21/768 ; H01L21/56 ; H01L21/683 ; H01L21/288 ; H01L23/367 ; H01L23/16 ; H01L23/538 ; H01L23/00 ; H01L21/78 ; H01L21/48
Abstract:
An assembly is provided including one or more semiconductor dice attached on a substrate, the semiconductor die provided with electrically-conductive stud bumps opposite the substrate. The stud bumps embedded in a molding compound molded thereon are exposed to grinding thus leveling the molding compound to expose the distal ends of the stud bumps at a surface of the molding compound. Recessed electrically-conductive lines extending over said surface of the molding compound with electrically-conductive lands over the distal ends of the stud bumps. A further molding compound is provided to cover the recessed electrically-conductive lines and surrounding the electrically-conductive lands.
Public/Granted literature
- US20190378774A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE Public/Granted day:2019-12-12
Information query
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