发明授权
- 专利标题： Die stack arrangement comprising a die-attach-film tape and method for producing same
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申请号： US16366490申请日： 2019-03-27
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公开(公告)号： US10861818B2公开(公告)日： 2020-12-08
- 发明人: Matthias Steiert , Karolina Gierl
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater Matsil, LLP
- 优先权： DE102018204772 20180328
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065 ; B81C1/00 ; B81B7/02 ; H01L25/07
摘要：
A device includes a base substrate with a sensor component arranged thereon; a spacer layer on the base substrate, wherein the spacer layer is structured in order to predefine a cavity region, in which the sensor component is arranged in an exposed fashion on the base substrate, and a DAF tape element (DAF=Die-Attach-Film) on a stack element, wherein the DAF tape element mechanically fixedly connects the stack element to the spacer layer arranged on the base substrate and to obtain the cavity region.
公开/授权文献
- US20190304945A1 DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME 公开/授权日：2019-10-03
信息查询
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