Invention Grant
- Patent Title: Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package
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Application No.: US16385363Application Date: 2019-04-16
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Publication No.: US10861826B2Publication Date: 2020-12-08
- Inventor: Kyung Suk Oh , Do-Hyun Kim , Sunwon Kang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2018-0105380 20180904
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/40 ; H01L25/065 ; H01L25/00

Abstract:
A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip and a connection structure. The second semiconductor chip includes a first segment that protrudes outwardly beyond one side of the first semiconductor chip and a second connection pad on a bottom surface of the first segment of the second semiconductor chip. The connection structure includes a first structure between the substrate and the first segment of the second semiconductor chip and a first columnar conductor penetrating the first structure to be in contact with the substrate and being disposed between the second connection pad and the substrate, thereby electrically connecting the second semiconductor chip to the substrate.
Public/Granted literature
Information query
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