Invention Grant
- Patent Title: Package structure and method of manufacturing the same
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Application No.: US16889828Application Date: 2020-06-02
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Publication No.: US10861832B2Publication Date: 2020-12-08
- Inventor: Chien-Li Kuo
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201410174317 20140428
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00 ; H01L21/78 ; H01L23/00 ; H01L21/56 ; H01L25/18 ; H01L23/31
Abstract:
The present invention provides a method of manufacturing a package structure. An array chip including a plurality of first dies is provided. A wafer including a plurality of second dies is provided. A package step is carried out to package the array chip onto the wafer so as to electrically connect the first die and the second die. The present invention further provides a semiconductor wafer and a package structure.
Public/Granted literature
- US20200294974A1 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-09-17
Information query
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